• All sections
  • H - Electricity
  • H01L - Semiconductor devices not covered by class
  • H01L 21/82 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components

Patent holdings for IPC class H01L 21/82

Total number of patents in this class: 1856

10-year publication summary

145
141
159
168
128
162
104
73
68
28
2015 2016 2017 2018 2019 2020 2021 2022 2023 2024

Principal owners for this class

Owner
All patents
This class
Taiwan Semiconductor Manufacturing Company, Ltd.
36809
202
Socionext Inc.
1575
82
NEC Corporation
32703
80
Panasonic Corporation
20786
70
Samsung Electronics Co., Ltd.
131630
67
International Business Machines Corporation
60644
63
Micron Technology, Inc.
24960
57
Texas Instruments Incorporated
19376
43
Semiconductor Energy Laboratory Co., Ltd.
10902
41
Renesas Electronics Corporation
6305
37
GLOBALFOUNDRIES U.S. Inc.
6459
33
Rohm Co., Ltd.
5843
28
Fujitsu Limited
19265
26
Applied Materials, Inc.
16587
25
Boe Technology Group Co., Ltd.
35384
24
Intel Corporation
45621
23
Infineon Technologies AG
8189
23
Sandisk Technologies LLC
5684
21
United Microelectronics Corp.
3921
18
Panasonic Intellectual Property Management Co., Ltd.
27812
16
Other owners 877