- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/82 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
Patent holdings for IPC class H01L 21/82
Total number of patents in this class: 1856
10-year publication summary
145
|
141
|
159
|
168
|
128
|
162
|
104
|
73
|
68
|
28
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
202 |
Socionext Inc. | 1575 |
82 |
NEC Corporation | 32703 |
80 |
Panasonic Corporation | 20786 |
70 |
Samsung Electronics Co., Ltd. | 131630 |
67 |
International Business Machines Corporation | 60644 |
63 |
Micron Technology, Inc. | 24960 |
57 |
Texas Instruments Incorporated | 19376 |
43 |
Semiconductor Energy Laboratory Co., Ltd. | 10902 |
41 |
Renesas Electronics Corporation | 6305 |
37 |
GLOBALFOUNDRIES U.S. Inc. | 6459 |
33 |
Rohm Co., Ltd. | 5843 |
28 |
Fujitsu Limited | 19265 |
26 |
Applied Materials, Inc. | 16587 |
25 |
Boe Technology Group Co., Ltd. | 35384 |
24 |
Intel Corporation | 45621 |
23 |
Infineon Technologies AG | 8189 |
23 |
Sandisk Technologies LLC | 5684 |
21 |
United Microelectronics Corp. | 3921 |
18 |
Panasonic Intellectual Property Management Co., Ltd. | 27812 |
16 |
Other owners | 877 |